For a wafer bumping stencil , the cutting technology must be capable of producing thousands of small , closely spaced apertures to extremely tight dimensional and positional tolerances 對(duì)于晶片凸起鋼網(wǎng),切割技術(shù)應(yīng)能夠生產(chǎn)尺寸和位置要求極其嚴(yán)的好幾千小而密的孔。